HEAT SINK

PROBLEM TO BE SOLVED: To provide a heat sink which can improve the efficiency of a heat dissipation space. SOLUTION: The heat sink 1 includes a base substrate 2, a fin assembly 3, heat pipes 4a and 4b, and a heat dissipation plate 5. The fin assembly 3 has a plurality of fins 3a arranged on the base...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	ANZAI HISAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a heat sink which can improve the efficiency of a heat dissipation space. SOLUTION: The heat sink 1 includes a base substrate 2, a fin assembly 3, heat pipes 4a and 4b, and a heat dissipation plate 5. The fin assembly 3 has a plurality of fins 3a arranged on the base substrate 2 perpendicularly thereto. The heat pipes 4a and 4b are each in a U-shape, and arranged substantially in parallel with the fins 3a in order to conduct heat of the base substrate 2 to the heat dissipation plate 5 provided on the fin assembly 3. The base substrate 2 and the heat dissipation plate 5 are connected thermally with each fin 3a. COPYRIGHT: (C)2011,JPO&INPIT