PRESSURE SENSOR DEVICE
PROBLEM TO BE SOLVED: To reduce costs, improve long-term reliability and improve the accuracy and reliability of measurement signals in a pressure sensor device. SOLUTION: A pressure sensor chip 41 having therein a diaphragm 45, a piezoresistance element, an amplifier circuit and various adjusting c...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KAMIYANAGI KATSUMICHI SAITO KAZUNORI SHINODA SHIGERU ASHINO KIMIYASU |
| description | PROBLEM TO BE SOLVED: To reduce costs, improve long-term reliability and improve the accuracy and reliability of measurement signals in a pressure sensor device. SOLUTION: A pressure sensor chip 41 having therein a diaphragm 45, a piezoresistance element, an amplifier circuit and various adjusting circuits is bonded to a seat member 42 so that the diaphragm 45 faces a through hole 46 of the seat member 42. The seat member 42 and a metal plate member 243 are bonded so that their through holes 46, 248 are connected. A metal pipe member 243 is adhered to a resin case 244 and the signal terminal 258 of the resin case 244 and the pressure sensor chip 41 are electrically connected by wire bonding 59 to make a pressure sensor cell 102. COPYRIGHT: (C)2011,JPO&INPIT |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2011102811A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2011102811A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2011102811A3</originalsourceid><addsrcrecordid>eNrjZBALCHINDg4NclUIdvUL9g9ScHEN83R25WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgaGhoYGRhaGho7GRCkCAPzBH5Y</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PRESSURE SENSOR DEVICE</title><source>esp@cenet</source><creator>KAMIYANAGI KATSUMICHI ; SAITO KAZUNORI ; SHINODA SHIGERU ; ASHINO KIMIYASU</creator><creatorcontrib>KAMIYANAGI KATSUMICHI ; SAITO KAZUNORI ; SHINODA SHIGERU ; ASHINO KIMIYASU</creatorcontrib><description>PROBLEM TO BE SOLVED: To reduce costs, improve long-term reliability and improve the accuracy and reliability of measurement signals in a pressure sensor device. SOLUTION: A pressure sensor chip 41 having therein a diaphragm 45, a piezoresistance element, an amplifier circuit and various adjusting circuits is bonded to a seat member 42 so that the diaphragm 45 faces a through hole 46 of the seat member 42. The seat member 42 and a metal plate member 243 are bonded so that their through holes 46, 248 are connected. A metal pipe member 243 is adhered to a resin case 244 and the signal terminal 258 of the resin case 244 and the pressure sensor chip 41 are electrically connected by wire bonding 59 to make a pressure sensor cell 102. COPYRIGHT: (C)2011,JPO&INPIT</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASURING ; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110526&DB=EPODOC&CC=JP&NR=2011102811A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110526&DB=EPODOC&CC=JP&NR=2011102811A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAMIYANAGI KATSUMICHI</creatorcontrib><creatorcontrib>SAITO KAZUNORI</creatorcontrib><creatorcontrib>SHINODA SHIGERU</creatorcontrib><creatorcontrib>ASHINO KIMIYASU</creatorcontrib><title>PRESSURE SENSOR DEVICE</title><description>PROBLEM TO BE SOLVED: To reduce costs, improve long-term reliability and improve the accuracy and reliability of measurement signals in a pressure sensor device. SOLUTION: A pressure sensor chip 41 having therein a diaphragm 45, a piezoresistance element, an amplifier circuit and various adjusting circuits is bonded to a seat member 42 so that the diaphragm 45 faces a through hole 46 of the seat member 42. The seat member 42 and a metal plate member 243 are bonded so that their through holes 46, 248 are connected. A metal pipe member 243 is adhered to a resin case 244 and the signal terminal 258 of the resin case 244 and the pressure sensor chip 41 are electrically connected by wire bonding 59 to make a pressure sensor cell 102. COPYRIGHT: (C)2011,JPO&INPIT</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBALCHINDg4NclUIdvUL9g9ScHEN83R25WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgaGhoYGRhaGho7GRCkCAPzBH5Y</recordid><startdate>20110526</startdate><enddate>20110526</enddate><creator>KAMIYANAGI KATSUMICHI</creator><creator>SAITO KAZUNORI</creator><creator>SHINODA SHIGERU</creator><creator>ASHINO KIMIYASU</creator><scope>EVB</scope></search><sort><creationdate>20110526</creationdate><title>PRESSURE SENSOR DEVICE</title><author>KAMIYANAGI KATSUMICHI ; SAITO KAZUNORI ; SHINODA SHIGERU ; ASHINO KIMIYASU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2011102811A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KAMIYANAGI KATSUMICHI</creatorcontrib><creatorcontrib>SAITO KAZUNORI</creatorcontrib><creatorcontrib>SHINODA SHIGERU</creatorcontrib><creatorcontrib>ASHINO KIMIYASU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAMIYANAGI KATSUMICHI</au><au>SAITO KAZUNORI</au><au>SHINODA SHIGERU</au><au>ASHINO KIMIYASU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PRESSURE SENSOR DEVICE</title><date>2011-05-26</date><risdate>2011</risdate><abstract>PROBLEM TO BE SOLVED: To reduce costs, improve long-term reliability and improve the accuracy and reliability of measurement signals in a pressure sensor device. SOLUTION: A pressure sensor chip 41 having therein a diaphragm 45, a piezoresistance element, an amplifier circuit and various adjusting circuits is bonded to a seat member 42 so that the diaphragm 45 faces a through hole 46 of the seat member 42. The seat member 42 and a metal plate member 243 are bonded so that their through holes 46, 248 are connected. A metal pipe member 243 is adhered to a resin case 244 and the signal terminal 258 of the resin case 244 and the pressure sensor chip 41 are electrically connected by wire bonding 59 to make a pressure sensor cell 102. COPYRIGHT: (C)2011,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JP2011102811A |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | PRESSURE SENSOR DEVICE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T09%3A19%3A53IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KAMIYANAGI%20KATSUMICHI&rft.date=2011-05-26&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2011102811A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |