SUBSTRATE FOR MOUNTING SEMICONDUCTOR LIGHT EMITTING ELEMENT, BACKLIGHT CHASSIS, DISPLAY DEVICE, AND TELEVISION RECEIVER

PROBLEM TO BE SOLVED: To provide a substrate for mounting a semiconductor light emitting element, which can excellently radiate heat generated from a semiconductor light emitting element with a simple structure without increasing manufacturing steps and which can control the rise of temperature when mounting a flip-chip semiconductor light emitting element, a back light chassis including the substrate, a display device, and a television receiver. SOLUTION: The substrate 1 for mounting the semiconductor light emitting element includes a pair of electrode patterns 4 and 5 connected to a positive electrode and a negative electrode of an LED chip 2 on an insulating substrate 3 having a thermal conductivity of 1 W/(mK) or less and a wiring pattern 6 pulled out from the pair of electrode patterns 4 and 5. The pair of electrode patterns 4 and 5 have larger area than that of the wiring pattern 6. Accordingly, heat from the LED chip 2 is excellently conducted to the insulating substrate 3 via the large electrode patterns 4 and 5. COPYRIGHT: (C)2011,JPO&INPIT