METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To prevent malfunction due to damage of a semiconductor chip while permitting mounting by heating and pressing thereof, in a method of manufacturing a semiconductor device by sucking to hold the semiconductor chip on a collet and mounting on a base material. SOLUTION: The semiconductor chip having a chamfered area 22 whose corners located along a periphery on one plane are chamfered in a tapered form is used as the semiconductor chip 20. A collet having a tapered surface 101 corresponding to the chamfered area 22 on a region facing the chamfered area 22 of the semiconductor chip 20 and equipped with a hole 103 for suction for sucking the semiconductor chip 20 on the tapered surface 101 is used as the collet 100. While the tapered surface 101 of the collet 100 is in contact with the chamfered area 22, the semiconductor chip 20 is sucked by the hole 103 for suction, thereby holding the semiconductor chip 20 by the collet 100. COPYRIGHT: (C)2011,JPO&INPIT