HEAT SINK

PROBLEM TO BE SOLVED: To provide a heat sink that improves heat-dissipation efficiency while sufficiently securing a cross-sectional area of an extrusion part. SOLUTION: The heat sink 1 includes a body 10 having: a base 11 formed with a heating-element mounting part 11c; and a plurality of heat-diss...

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Bibliographische Detailangaben
Hauptverfasser:	SATO SHINYA, HORIKAWA HIROSHI, IGARI TAKAAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a heat sink that improves heat-dissipation efficiency while sufficiently securing a cross-sectional area of an extrusion part. SOLUTION: The heat sink 1 includes a body 10 having: a base 11 formed with a heating-element mounting part 11c; and a plurality of heat-dissipating fins 12, 13 erected on the base 11. The heat sink is formed by die-casting. The tip edge of each heat-dissipating fin 13 is formed with each extrusion part 14. The extrusion parts are pressed by extrusion pins, provided in a die, when releasing the body 10 from a die-casting die. The extrusion part 14 is formed to have a rectangular cross-section and protrudingly provided on one of the side faces of the heat-dissipating fin 13. COPYRIGHT: (C)2011,JPO&INPIT