METHOD FOR PREPARING PATTERNING BASE MATERIAL

PROBLEM TO BE SOLVED: To solve a request of fine working of high quality having high pattern superposition accuracy without omission due to deformation of a pattern with a simple process/equipment scale in a reverse printing method for transfer onto a surface of a base material to be printed, which...

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Bibliographische Detailangaben
Hauptverfasser: NISHIKAWA YOHEI, SEKINE NORIMASA, TAMAKOSHI MAMORU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To solve a request of fine working of high quality having high pattern superposition accuracy without omission due to deformation of a pattern with a simple process/equipment scale in a reverse printing method for transfer onto a surface of a base material to be printed, which is developed instead of a photolithography method having problems of process complication and an increase of an equipment scale. SOLUTION: In a method for preparing a layered structural pattern constituted of at least two layers including a pattern upper layer part and a lower layer part on a base material, the pattern upper layer part is larger than the pattern layer on the lower side thereof and a pattern surface part made of the image pattern upper layer part is protruded in a horizontal direction in a pattern sectional shape. COPYRIGHT: (C)2011,JPO&INPIT