MOLD REMOVING METHOD AND MOLD REMOVING DEVICE

PROBLEM TO BE SOLVED: To provide a mold removing method and a mold removing device for removing a mold finely at high speed with simple device constitution up to a minimum thickness at which an IC chip is not damaged. SOLUTION: The mold removing method includes: a process of setting removal conditions for the mold; a process of installing the IC chip at the emission position of laser beam; a measuring process of positioning a mold member in a height position direction, emitting laser light for measurement to measure reflected/scattered light quantities at X- and Y-directional coordinate positions of the mold member, and storing measured values; a process of determining whether the removal conditions for the mold are met; a finish processing process of performing laser finish processing under processing conditions set according to the removal conditions for the mold when the removal conditions for the mold are met; and primary processing process of performing laser primary processing under processing conditions set according to the stored measured values of the X- and Y-directional coordinate positions when the removal conditions for the mold are not met, and returning to the measuring process after the laser primary processing is completed. COPYRIGHT: (C)2011,JPO&INPIT