CIRCUIT MODULE AND METHOD OF MANUFACTURING CIRCUIT MODULE
PROBLEM TO BE SOLVED: To highly precisely control a tilt angle of an acceleration sensor to a circuit substrate, to allow the acceleration sensor to highly precisely detect an acceleration, and to reduce a tilt angle error by suppressing influence due to temperature change in mounting an electronic...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | SAKAI KOJI YOSHIYASU TOSHIAKI IBARA NOBUYUKI MISAWA ATSUSHI |
| description | PROBLEM TO BE SOLVED: To highly precisely control a tilt angle of an acceleration sensor to a circuit substrate, to allow the acceleration sensor to highly precisely detect an acceleration, and to reduce a tilt angle error by suppressing influence due to temperature change in mounting an electronic device with the need of highly precisely maintaining an azimuth. SOLUTION: The circuit module includes a circuit substrate 10 which is fixed by two or more fixing points and forms a component loading part and a circuit pattern on a surface and a component chip 20 which is loaded on the component loading part of the circuit substrate. The component chip 20 is mounted near an inner edge of a cantilever 22 which is formed by two slits 21 formed from positions with a predetermined space at one side of the circuit substrate and extends from near the center of the circuit substrate onto the one side. COPYRIGHT: (C)2011,JPO&INPIT |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2011094987A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2011094987A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2011094987A3</originalsourceid><addsrcrecordid>eNrjZLB09gxyDvUMUfD1dwn1cVVw9HNR8HUN8fB3UfB3U_B19At1c3QOCQ3y9HNXQFXKw8CalphTnMoLpbkZlNxcQ5w9dFML8uNTiwsSk1PzUkvivQKMDAwNDSxNLC3MHY2JUgQA1P4pNQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CIRCUIT MODULE AND METHOD OF MANUFACTURING CIRCUIT MODULE</title><source>esp@cenet</source><creator>SAKAI KOJI ; YOSHIYASU TOSHIAKI ; IBARA NOBUYUKI ; MISAWA ATSUSHI</creator><creatorcontrib>SAKAI KOJI ; YOSHIYASU TOSHIAKI ; IBARA NOBUYUKI ; MISAWA ATSUSHI</creatorcontrib><description>PROBLEM TO BE SOLVED: To highly precisely control a tilt angle of an acceleration sensor to a circuit substrate, to allow the acceleration sensor to highly precisely detect an acceleration, and to reduce a tilt angle error by suppressing influence due to temperature change in mounting an electronic device with the need of highly precisely maintaining an azimuth. SOLUTION: The circuit module includes a circuit substrate 10 which is fixed by two or more fixing points and forms a component loading part and a circuit pattern on a surface and a component chip 20 which is loaded on the component loading part of the circuit substrate. The component chip 20 is mounted near an inner edge of a cantilever 22 which is formed by two slits 21 formed from positions with a predetermined space at one side of the circuit substrate and extends from near the center of the circuit substrate onto the one side. COPYRIGHT: (C)2011,JPO&INPIT</description><language>eng</language><subject>GYROSCOPIC INSTRUMENTS ; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT ; MEASURING ; MEASURING DISTANCES, LEVELS OR BEARINGS ; MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK ; NAVIGATION ; PHOTOGRAMMETRY OR VIDEOGRAMMETRY ; PHYSICS ; SURVEYING ; TESTING</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110512&DB=EPODOC&CC=JP&NR=2011094987A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110512&DB=EPODOC&CC=JP&NR=2011094987A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAKAI KOJI</creatorcontrib><creatorcontrib>YOSHIYASU TOSHIAKI</creatorcontrib><creatorcontrib>IBARA NOBUYUKI</creatorcontrib><creatorcontrib>MISAWA ATSUSHI</creatorcontrib><title>CIRCUIT MODULE AND METHOD OF MANUFACTURING CIRCUIT MODULE</title><description>PROBLEM TO BE SOLVED: To highly precisely control a tilt angle of an acceleration sensor to a circuit substrate, to allow the acceleration sensor to highly precisely detect an acceleration, and to reduce a tilt angle error by suppressing influence due to temperature change in mounting an electronic device with the need of highly precisely maintaining an azimuth. SOLUTION: The circuit module includes a circuit substrate 10 which is fixed by two or more fixing points and forms a component loading part and a circuit pattern on a surface and a component chip 20 which is loaded on the component loading part of the circuit substrate. The component chip 20 is mounted near an inner edge of a cantilever 22 which is formed by two slits 21 formed from positions with a predetermined space at one side of the circuit substrate and extends from near the center of the circuit substrate onto the one side. COPYRIGHT: (C)2011,JPO&INPIT</description><subject>GYROSCOPIC INSTRUMENTS</subject><subject>INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT</subject><subject>MEASURING</subject><subject>MEASURING DISTANCES, LEVELS OR BEARINGS</subject><subject>MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK</subject><subject>NAVIGATION</subject><subject>PHOTOGRAMMETRY OR VIDEOGRAMMETRY</subject><subject>PHYSICS</subject><subject>SURVEYING</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB09gxyDvUMUfD1dwn1cVVw9HNR8HUN8fB3UfB3U_B19At1c3QOCQ3y9HNXQFXKw8CalphTnMoLpbkZlNxcQ5w9dFML8uNTiwsSk1PzUkvivQKMDAwNDSxNLC3MHY2JUgQA1P4pNQ</recordid><startdate>20110512</startdate><enddate>20110512</enddate><creator>SAKAI KOJI</creator><creator>YOSHIYASU TOSHIAKI</creator><creator>IBARA NOBUYUKI</creator><creator>MISAWA ATSUSHI</creator><scope>EVB</scope></search><sort><creationdate>20110512</creationdate><title>CIRCUIT MODULE AND METHOD OF MANUFACTURING CIRCUIT MODULE</title><author>SAKAI KOJI ; YOSHIYASU TOSHIAKI ; IBARA NOBUYUKI ; MISAWA ATSUSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2011094987A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>GYROSCOPIC INSTRUMENTS</topic><topic>INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT</topic><topic>MEASURING</topic><topic>MEASURING DISTANCES, LEVELS OR BEARINGS</topic><topic>MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK</topic><topic>NAVIGATION</topic><topic>PHOTOGRAMMETRY OR VIDEOGRAMMETRY</topic><topic>PHYSICS</topic><topic>SURVEYING</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SAKAI KOJI</creatorcontrib><creatorcontrib>YOSHIYASU TOSHIAKI</creatorcontrib><creatorcontrib>IBARA NOBUYUKI</creatorcontrib><creatorcontrib>MISAWA ATSUSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAKAI KOJI</au><au>YOSHIYASU TOSHIAKI</au><au>IBARA NOBUYUKI</au><au>MISAWA ATSUSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CIRCUIT MODULE AND METHOD OF MANUFACTURING CIRCUIT MODULE</title><date>2011-05-12</date><risdate>2011</risdate><abstract>PROBLEM TO BE SOLVED: To highly precisely control a tilt angle of an acceleration sensor to a circuit substrate, to allow the acceleration sensor to highly precisely detect an acceleration, and to reduce a tilt angle error by suppressing influence due to temperature change in mounting an electronic device with the need of highly precisely maintaining an azimuth. SOLUTION: The circuit module includes a circuit substrate 10 which is fixed by two or more fixing points and forms a component loading part and a circuit pattern on a surface and a component chip 20 which is loaded on the component loading part of the circuit substrate. The component chip 20 is mounted near an inner edge of a cantilever 22 which is formed by two slits 21 formed from positions with a predetermined space at one side of the circuit substrate and extends from near the center of the circuit substrate onto the one side. COPYRIGHT: (C)2011,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JP2011094987A |
| source | esp@cenet |
| subjects | GYROSCOPIC INSTRUMENTS INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT MEASURING MEASURING DISTANCES, LEVELS OR BEARINGS MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK NAVIGATION PHOTOGRAMMETRY OR VIDEOGRAMMETRY PHYSICS SURVEYING TESTING |
| title | CIRCUIT MODULE AND METHOD OF MANUFACTURING CIRCUIT MODULE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T02%3A13%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SAKAI%20KOJI&rft.date=2011-05-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2011094987A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |