CIRCUIT MODULE AND METHOD OF MANUFACTURING CIRCUIT MODULE

PROBLEM TO BE SOLVED: To highly precisely control a tilt angle of an acceleration sensor to a circuit substrate, to allow the acceleration sensor to highly precisely detect an acceleration, and to reduce a tilt angle error by suppressing influence due to temperature change in mounting an electronic...

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Bibliographische Detailangaben
Hauptverfasser: SAKAI KOJI, YOSHIYASU TOSHIAKI, IBARA NOBUYUKI, MISAWA ATSUSHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To highly precisely control a tilt angle of an acceleration sensor to a circuit substrate, to allow the acceleration sensor to highly precisely detect an acceleration, and to reduce a tilt angle error by suppressing influence due to temperature change in mounting an electronic device with the need of highly precisely maintaining an azimuth. SOLUTION: The circuit module includes a circuit substrate 10 which is fixed by two or more fixing points and forms a component loading part and a circuit pattern on a surface and a component chip 20 which is loaded on the component loading part of the circuit substrate. The component chip 20 is mounted near an inner edge of a cantilever 22 which is formed by two slits 21 formed from positions with a predetermined space at one side of the circuit substrate and extends from near the center of the circuit substrate onto the one side. COPYRIGHT: (C)2011,JPO&INPIT