HIGH-FREQUENCY MODULE AND RECEIVER
PROBLEM TO BE SOLVED: To provide a compact high-frequency module and a receiver for discharging electric field and magnetic field to the outside of a shield part, allowing electronic components to be arranged more close to each other in the shield part. SOLUTION: The high-frequency module includes i...
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creator | MASUMURA HITOSHI KAITA TAKAYUKI IMAI MASASHI |
description | PROBLEM TO BE SOLVED: To provide a compact high-frequency module and a receiver for discharging electric field and magnetic field to the outside of a shield part, allowing electronic components to be arranged more close to each other in the shield part. SOLUTION: The high-frequency module includes integrated circuits (IC) 112 and 113 each incorporating an oscillator including an inductor, and a shield case 114 as a shield part for covering the ICs 112 and 113. Openings 116A and 116B which are one half or more the profile size of the ICs 112 and 113 are formed in the regions of the shield case 114 as a shield part, facing the positions where the ICs 112 and 113 are arranged. COPYRIGHT: (C)2011,JPO&INPIT |
format | Patent |
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SOLUTION: The high-frequency module includes integrated circuits (IC) 112 and 113 each incorporating an oscillator including an inductor, and a shield case 114 as a shield part for covering the ICs 112 and 113. Openings 116A and 116B which are one half or more the profile size of the ICs 112 and 113 are formed in the regions of the shield case 114 as a shield part, facing the positions where the ICs 112 and 113 are arranged. 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SOLUTION: The high-frequency module includes integrated circuits (IC) 112 and 113 each incorporating an oscillator including an inductor, and a shield case 114 as a shield part for covering the ICs 112 and 113. Openings 116A and 116B which are one half or more the profile size of the ICs 112 and 113 are formed in the regions of the shield case 114 as a shield part, facing the positions where the ICs 112 and 113 are arranged. 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SOLUTION: The high-frequency module includes integrated circuits (IC) 112 and 113 each incorporating an oscillator including an inductor, and a shield case 114 as a shield part for covering the ICs 112 and 113. Openings 116A and 116B which are one half or more the profile size of the ICs 112 and 113 are formed in the regions of the shield case 114 as a shield part, facing the positions where the ICs 112 and 113 are arranged. COPYRIGHT: (C)2011,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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subjects | ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY TRANSMISSION |
title | HIGH-FREQUENCY MODULE AND RECEIVER |
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