HIGH-FREQUENCY MODULE AND RECEIVER

PROBLEM TO BE SOLVED: To provide a compact high-frequency module and a receiver for discharging electric field and magnetic field to the outside of a shield part, allowing electronic components to be arranged more close to each other in the shield part. SOLUTION: The high-frequency module includes i...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MASUMURA HITOSHI, KAITA TAKAYUKI, IMAI MASASHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a compact high-frequency module and a receiver for discharging electric field and magnetic field to the outside of a shield part, allowing electronic components to be arranged more close to each other in the shield part. SOLUTION: The high-frequency module includes integrated circuits (IC) 112 and 113 each incorporating an oscillator including an inductor, and a shield case 114 as a shield part for covering the ICs 112 and 113. Openings 116A and 116B which are one half or more the profile size of the ICs 112 and 113 are formed in the regions of the shield case 114 as a shield part, facing the positions where the ICs 112 and 113 are arranged. COPYRIGHT: (C)2011,JPO&INPIT