SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device and a method of manufacturing semiconductor device which can prevent peeling and cracks of a passivation film on an element forming region of a semiconductor chip. SOLUTION: An annular groove 12 is formed on an outermost surface part of the semiconductor chip 1 so as to surround the element forming region A in plane view overlooking a surface of the semiconductor chip 1. The passivation film 11 is divided into a center side part 111 on an inner side and a peripheral side part 112 on an outer side with the groove 12 interposed therebetween. A sealing resin layer 4 bites into the groove 12 between the center side part 111 and the peripheral side part 112. COPYRIGHT: (C)2011,JPO&INPIT