ELECTRONIC COMPONENT AND ELECTRONIC EQUIPMENT, AND MOUNTING STRUCTURE FOR ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To suppress a void formed in solder when an electronic component is fitted to a substrate. SOLUTION: The electronic component 1 has a terminal electrode 2 exposed to the outside from a bottom face 1B. A plurality of terminal electrodes 2 are provided on the bottom face 1B of th...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KOMATSU MASATORA, YASUI TSUTOMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDUCTANCES MAGNETS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESISTORS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES SEMICONDUCTOR DEVICES TRANSFORMERS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To suppress a void formed in solder when an electronic component is fitted to a substrate. SOLUTION: The electronic component 1 has a terminal electrode 2 exposed to the outside from a bottom face 1B. A plurality of terminal electrodes 2 are provided on the bottom face 1B of the electronic component 1. The electronic component 1 has a size of ≤1,005 M, namely, a dimension W of ≤1.05 mm in a longitudinal direction (shown by an arrow L) and a dimension H of ≤0.55 mm in a lateral direction (shown by an arrow S). The terminal electrode 2 has a dimension (h) of 30 to 120 μm in a lateral direction, and the ratio h/w of a dimension w in a longitudinal direction of the terminal electrode 2 to the dimension (h) in the lateral direction is 0.324 to 0.480. COPYRIGHT: (C)2011,JPO&INPIT