MATERIAL FOR DEPOSITING ELECTROCONDUCTIVE BARRIER FILM, METHOD FOR DEPOSITING ELECTROCONDUCTIVE BARRIER FILM AND METHOD FOR DEPOSITING WIRING FILM

PROBLEM TO BE SOLVED: To provide a material for depositing an electroconductive barrier film which can be deposited even when the electroconductive barrier film has 1/5-1/7 aspect ratio and ≤10 nm thickness, and which has an excellent property of preventing copper diffusion (barrier properties), sma...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HIIRO SHIGEKI, HOSHINO ASAKO, MACHIDA HIDEAKI, SUZUKI TOSHIE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a material for depositing an electroconductive barrier film which can be deposited even when the electroconductive barrier film has 1/5-1/7 aspect ratio and ≤10 nm thickness, and which has an excellent property of preventing copper diffusion (barrier properties), small electric resistance and excellent adhesiveness to a copper film. SOLUTION: The material for depositing the electroconductive barrier film is used for depositing an electroconductive Ta-Ti barrier film as an undercoat film of the copper film by a chemical vapor deposition method and includes a Ta-containing metal organic compound, a Ti-containing metal organic compound and a solvent for dissolving one or both of the Ta-containing metal organic compound and the Ti-containing metal organic compound. COPYRIGHT: (C)2011,JPO&INPIT