SUBSTRATE PROCESSING APPARATUS

PROBLEM TO BE SOLVED: To provide a technique for reducing the occurrence of heating unevenness in heat processing on a substrate while suppressing a remarkable increase in substrate processing cost. SOLUTION: A heating plate 9 is provided with a discharge port 101 for jetting a heated gas at a surface part opposed to the substrate 9. The discharge port 101 comprises: a first hole H1 having a relatively wide opening; and a second hole H2 communicating with the first hole H1 and an internal flow passage 102 and having a relatively narrow opening. Thus, the opening of the first hole H1 is relatively wide, so that air having passed through the second hole H2 is spread over the entire opening in the first hole H1, and consequently the flow velocity of the air jetting from the discharge port 101 can be reduced. Local heating of the substrate 9 is therefore reducible. COPYRIGHT: (C)2011,JPO&INPIT