SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing occurrence of a pattern defect in a wafer peripheral part when chips are arranged in a surface of a semiconductor wafer, and to provide a method of manufacturing the same. SOLUTION: The semiconductor wafer 1 has a main sur...

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Bibliographische Detailangaben
1. Verfasser:	NARASAKI ATSUSHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing occurrence of a pattern defect in a wafer peripheral part when chips are arranged in a surface of a semiconductor wafer, and to provide a method of manufacturing the same. SOLUTION: The semiconductor wafer 1 has a main surface. A main chip region 2 is formed on the main surface. A sub chip region 3 has a small area relative to that of the main chip region 2, and located on an edge side of the semiconductor wafer 1 relative to the main chip region 2. The sub chip region 3 has a design pattern identical to that of the main chip region 2. COPYRIGHT: (C)2011,JPO&INPIT