THIN-FILM CHIP RESISTOR

PROBLEM TO BE SOLVED: To provide a thin-film chip resistor that can disperse load heating, adapt to higher electric power, and correct a resistance value with higher precision. SOLUTION: A thin-film resistance layer 24, which is formed to be electrically connected with a pair of upper-surface electrode layers 22 formed at both ends of an upper surface of an insulating substrate 21, includes: a ladder-shaped first parallel resistance pattern 24a for rough adjustment, which is electrically connected to one of the pair of upper-surface electrode layers 22; a second parallel resistance pattern 24e for rough adjustment, which is electrically connected to the first parallel resistance pattern 24a and formed by connecting adjacent fold parts 24c of zigzag resistance patterns 24b by a substantially channel-shaped resistance pattern 24d; and a resistance pattern 24f for fine adjustment, which is electrically connected between the second parallel resistance pattern 24e and the other one of the pair of upper-surface electrode layers 22. A plurality set of second parallel resistance patterns 24e for rough adjustment are connected in series, and arranged at a substantially center part of the insulating substrate 21. COPYRIGHT: (C)2011,JPO&INPIT