Cu ALLOY STRIP AND METHOD OF PRODUCING THE SAME

PROBLEM TO BE SOLVED: To provide a Cu alloy strip to be used for a connector, having small insertion force and free from the increase of the contact resistance even in use at a high temperature. SOLUTION: Three layers of Ni2/Cu3/Sn4 are plated on a Cu alloy 1 which is a base material of the Cu alloy strip. After that, a Cu-Sn intermetallic compound layer 5 is formed up to the surface by reflow. Further a Sn4 is plated thin on the surface of the Cu-Sn intermetallic compound layer 5. In such a way, the unevenness on the surface of the formed Cu-Sn intermetallic compound layer 5 is small one of ≤0.5 μm Rmax. The thickness of the Sn layer 4 formed on the surface of Cu-Sn intermetallic compound layer is ≥0.3 μm and ≤0.8 μm. The connecter having small insertion force and free from the increase of the contact resistance even when used at the high temperature is obtained by using the Cu alloy strip for the connecter. COPYRIGHT: (C)2011,JPO&INPIT