RESIN COMPOSITION FOR CIRCUIT BOARD, PREPREG, LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a resin composition for a circuit board, which has a low thermal expansion rate and excellent heat resistance and adhesiveness with a conductor circuit; a prepreg using the resin composition; a laminate; a printed wiring board; and a semiconductor device. SOLUTION: T...

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Bibliographische Detailangaben
1. Verfasser:	TOBISAWA AKIHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition for a circuit board, which has a low thermal expansion rate and excellent heat resistance and adhesiveness with a conductor circuit; a prepreg using the resin composition; a laminate; a printed wiring board; and a semiconductor device. SOLUTION: The resin composition for a circuit board includes following compounds as essential constituents: a compound (A) having two or more maleimide groups in the molecule; a compound (B) having two or more amino groups in the molecule and having an aromatic ring structure; and a compound (C) wherein hydroxy groups are bonded individually to two or more adjacent carbon atoms constituting an aromatic ring. COPYRIGHT: (C)2011,JPO&INPIT