RESIN COMPOSITION AND ITS APPLICATION

PROBLEM TO BE SOLVED: To provide a resin composition having excellent radiation sensitivity with a low dielectric constant, low water absorption and heat resistance maintained, which are originally possessed by a polyphenylene ether or the like, and can be heat-treated at low temperature. SOLUTION:...

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Bibliographische Detailangaben
1. Verfasser:	MIZOGUCHI KATSUHISA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition having excellent radiation sensitivity with a low dielectric constant, low water absorption and heat resistance maintained, which are originally possessed by a polyphenylene ether or the like, and can be heat-treated at low temperature. SOLUTION: The resin composition contains (A) a compound having an aromatic ring and a relative dielectric constant of 5 or below, (B) a crosslinking agent represented by general formula (1) and (C) an acid generator [in formula, R1denotes an n-valent hydrocarbon group, n denotes an integer of 1 to 4, and R2s each independently denotes a hydrogen atom, a group having a cation or an electron doner group in the presence of an acid]. COPYRIGHT: (C)2011,JPO&INPIT