CHIP

PROBLEM TO BE SOLVED: To provide a chip to be very easily manufactured with a good cost efficiency, and to be soldered with a high process reliability. SOLUTION: A chip is formed such that a layer aggregate 2 for a solder connecting unit is formed on one side of a chip body 1 formed from a semicondu...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	BERBERICH SVEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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