CHIP

PROBLEM TO BE SOLVED: To provide a chip to be very easily manufactured with a good cost efficiency, and to be soldered with a high process reliability. SOLUTION: A chip is formed such that a layer aggregate 2 for a solder connecting unit is formed on one side of a chip body 1 formed from a semicondu...

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Bibliographische Detailangaben
1. Verfasser:	BERBERICH SVEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a chip to be very easily manufactured with a good cost efficiency, and to be soldered with a high process reliability. SOLUTION: A chip is formed such that a layer aggregate 2 for a solder connecting unit is formed on one side of a chip body 1 formed from a semiconductor material, the layer aggregate 2 is also formed from a plurality of metal layers 3, 4, 5, 6 with one layer laminated upon another layer through a physical coating process, and a soldering layer 5 is formed between a noble metal layer 6 positioned on the surface of the layer aggregate 2 and the chip body 1. In order to avoid undesirable permeation of solder 7 passing through the layer aggregate 2, the solder layer 5 has at least interfaces G1, G2 formed by the interruption of the coating process. COPYRIGHT: (C)2011,JPO&INPIT