MICRONEEDLE ARRAY AND METHOD OF MANUFACTURING MICRONEEDLE ARRAY

PROBLEM TO BE SOLVED: To provide a microneedle array, where a through-hole is formed and the through-hole is communicated with a micropassage, and a method of manufacturing the same, easily manufacturing the microneedle array. SOLUTION: This microneedle array includes: a base material 3 for a micron...

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Hauptverfasser: SUGIMURA TATSU, KOKAYU TAKAYUKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a microneedle array, where a through-hole is formed and the through-hole is communicated with a micropassage, and a method of manufacturing the same, easily manufacturing the microneedle array. SOLUTION: This microneedle array includes: a base material 3 for a microneedle array in which a microneedle having a fine through-hole is formed; a base material 5 for a cover, made to adhere to and fixed to the base material for the microneedle array and having a structural part for injecting a drug; and a micropassage, which is formed on the base material for the microneedle array and/or the base material for the cover to communicate the structure for injecting the drug with the through-hole 11 of the microneedle. COPYRIGHT: (C)2011,JPO&INPIT