THERMOSETTING ADHESIVE COMPOSITION, AND SEMICONDUCTOR DEVICE FABRICATED USING THE SAME

PROBLEM TO BE SOLVED: To provide a thermosetting adhesive composition capable of providing excellent reliability without causing trouble such as a crack to a semiconductor device even in a high-temperature environment such as 260°C or above, and a semiconductor device fabricated using the same, in a one-side resin-sealed type semiconductor device. SOLUTION: This thermosetting adhesive composition is used for a method of manufacturing a semiconductor device which includes processes of: mounting a semiconductor element on a die pad of a metallic support through the thermosetting adhesive composition; setting the adhesive composition by a predetermined heating condition A, and sticking the semiconductor element to the metallic support; and sealing the metallic support and the semiconductor element by a sealing resin composition in a state where a surface of the die pad of the metallic support with the semiconductor element stuck thereto and the side of the opposite surface thereof are exposed. In the thermosetting adhesive composition, a warpage amount 1 and a warpage amount 2 of the thermosetting adhesive composition in a predetermined warpage evaluation test S satisfy predetermined condition expressions 1 and 2. COPYRIGHT: (C)2011,JPO&INPIT