METHOD OF MANUFACTURING CERAMIC SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method in which a fine conductive pattern of a uniform film thickness is formed on a surface of a baked ceramic substrate. SOLUTION: The method of manufacturing a ceramic substrate includes the steps of: forming a coating layer consisting of a coating material on a...

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Bibliographische Detailangaben
Hauptverfasser:	SHIGEMI ATSUSHI, SEGAWA SHIGETOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method in which a fine conductive pattern of a uniform film thickness is formed on a surface of a baked ceramic substrate. SOLUTION: The method of manufacturing a ceramic substrate includes the steps of: forming a coating layer consisting of a coating material on a surface of a baked ceramic substrate; forming a conductor pattern consisting of conductive paste on the coating layer; and thermally decomposing the coating layer at a baking temperature of the conductive paste and combining the conductor pattern with the surface of the baked ceramic substrate. COPYRIGHT: (C)2011,JPO&INPIT