DEVICE MOUNTING BOARD, SEMICONDUCTOR MODULE AND PORTABLE APPARATUS

PROBLEM TO BE SOLVED: To provide a device mounting board which has bump electrodes capable of enhancing reliability in connection with a semiconductor device. SOLUTION: The device mounting board 20 includes: an insulating resin layer 32; a wiring layer 34 provided on one principal surface S1 of the...

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Hauptverfasser: YAMAMOTO TETSUYA, NAKAZATO MAYUMI, SAITO KOICHI
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creator YAMAMOTO TETSUYA
NAKAZATO MAYUMI
SAITO KOICHI
description PROBLEM TO BE SOLVED: To provide a device mounting board which has bump electrodes capable of enhancing reliability in connection with a semiconductor device. SOLUTION: The device mounting board 20 includes: an insulating resin layer 32; a wiring layer 34 provided on one principal surface S1 of the insulating resin layer 32; and bump electrodes 36 electrically connected with the wiring layer 34 and protruding to the insulating resin layer 32 side from the wiring layer 34. A semiconductor device 50 is electrically connected to the bump electrodes 36, so that a semiconductor module 10 is formed. A recess is provided on each top surface of the bump electrodes 36. The recess communicates to an opening each provided on sides of the bump electrodes 36. COPYRIGHT: (C)2011,JPO&INPIT
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title DEVICE MOUNTING BOARD, SEMICONDUCTOR MODULE AND PORTABLE APPARATUS
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