DEVICE MOUNTING BOARD, SEMICONDUCTOR MODULE AND PORTABLE APPARATUS

PROBLEM TO BE SOLVED: To provide a device mounting board which has bump electrodes capable of enhancing reliability in connection with a semiconductor device. SOLUTION: The device mounting board 20 includes: an insulating resin layer 32; a wiring layer 34 provided on one principal surface S1 of the insulating resin layer 32; and bump electrodes 36 electrically connected with the wiring layer 34 and protruding to the insulating resin layer 32 side from the wiring layer 34. A semiconductor device 50 is electrically connected to the bump electrodes 36, so that a semiconductor module 10 is formed. A recess is provided on each top surface of the bump electrodes 36. The recess communicates to an opening each provided on sides of the bump electrodes 36. COPYRIGHT: (C)2011,JPO&INPIT