PROCESSING METHOD BY LASER IRRADIATION

PROBLEM TO BE SOLVED: To provide a novel method high in processing efficiency and stability and excellent in safety in a processing method by laser irradiation. SOLUTION: A multi-layer structure (a printed wiring board including a base film and a metal layer, a conductive member forming laminated ma...

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Bibliographische Detailangaben
Hauptverfasser:	UEKI MASASHI, SHIOMI HIDEKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CONDUCTORS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a novel method high in processing efficiency and stability and excellent in safety in a processing method by laser irradiation. SOLUTION: A multi-layer structure (a printed wiring board including a base film and a metal layer, a conductive member forming laminated material including a base material layer and a catalyst ink layer or the like) having the base material layer 2 and a processing material layer 1, when the processing material layer 1 is processed by a method of irradiating it with a laser beam 5 through a condensing lens 6 or the like to form a desired pattern, a coolant such as water (ion exchange water 3) or the like is put on a stage 4 to cool it in contact with the base material layer side. COPYRIGHT: (C)2011,JPO&INPIT