METHOD FOR INSPECTING LAMINATION OF TAPE MEMBER, AND DEVICE THEREOF

PROBLEM TO BE SOLVED: To provide a method for inspecting the lamination of a tape member for improving the recognition rate of the presence of the bond of a tape member to a PCB board mounted on an FDP substrate, and to provide a device thereof. SOLUTION: The device includes an annular lighting device 50 for illuminating lighting beams to the PCB board 21, after laminating a tape-ike member; an electrode 22 on the surface of the PCB board illuminated with lighting beams; a lens 70 for forming the image of an ACF 100 bonded on a surface thereof; and a camera 80 for picking up an image. Additionally, four plates 61, 62 are arranged between the annular lighting device and the surface of the PCB board and cut off beams, in which the sides facing one another are arranged, along a direction in the extending direction of the electrode and a direction orthogonal to the extending direction of the electrode. COPYRIGHT: (C)2011,JPO&INPIT