PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having short curing time compared with a thermosetting resist composition containing a thermosetting resin, exhibiting sufficient durability to a chemical liquid used in a desmearing treatment, and having excellent adhesiveness to a...

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Hauptverfasser: MURATA KATSUTO, WATANABE YASUKAZU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having short curing time compared with a thermosetting resist composition containing a thermosetting resin, exhibiting sufficient durability to a chemical liquid used in a desmearing treatment, and having excellent adhesiveness to a substrate circuit layer, and a method for producing a printed circuit board. SOLUTION: The photosensitive resin composition contains a photosetting monomer having a fluorene structure, a photopolymerization initiator and a photosetting polymer. The method for producing the printed circuit board comprises: a step of forming a coating film by using the photosetting resin composition containing the photosetting monomer having the fluorene structure, the photopolymerization initiator and the photosetting polymer; a step of curing the coating film by light irradiation; a step of forming openings 14a, 14b, 14c by a laser processing of the cured coating film; and a step of removing smear formed by the laser processing. COPYRIGHT: (C)2011,JPO&INPIT