METHOD FOR FORMING COMPACT
PROBLEM TO BE SOLVED: To provide a method for forming a compact capable of suppressing dispersion of dimensions of a groove and a top part of a protrusion and forming the compact with good accuracy when forming the compact having the protrusion leading to the top part through a raised tilting surfac...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a method for forming a compact capable of suppressing dispersion of dimensions of a groove and a top part of a protrusion and forming the compact with good accuracy when forming the compact having the protrusion leading to the top part through a raised tilting surface at one end surface and having a plurality of the grooves extended almost in parallel from one side surface to an opposite side surface. SOLUTION: Material powder is compression molded using a mold assembly. The mold assembly includes: a fixed die 210 having a mold hole where the plurality of the grooves 212 extended almost in parallel from one end surface corresponding to the groove of the compact to the other end surface are formed; a movable die 220 having a recess corresponding to the protrusion of the compact at a side surface opposite to the fixed die and slidably fitted in the mold hole of the fixed die; and an upper punch 300 and a lower punch 400 slidably fitted in a space formed by the fixed die and the movable die and allowing the end surface to be a tilting surface directed the recess of the movable die. COPYRIGHT: (C)2011,JPO&INPIT |
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