ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide an electronic component package wherein dust generation in an atmosphere of high cleanliness can be suppressed even if the MAP method is used, and to provide a method of manufacturing the electronic component package. SOLUTION: The electronic component package includ...

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Hauptverfasser:	MIZUHASHI TAKAYUKI, YAMATANI MASAYA, SAKURAI YAMATO, KAMIMURA HIDEKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electronic component package wherein dust generation in an atmosphere of high cleanliness can be suppressed even if the MAP method is used, and to provide a method of manufacturing the electronic component package. SOLUTION: The electronic component package includes a circuit board 1 having a pair of main surface and edge, a capacitive humidity sensor 4 mounted on one main surface of the circuit board 1, a sealing resin 2 which seals the capacitive humidity sensor 4 on one main surface of the circuit board other than the edge, and an edge protective layer 3 which covers the sealing resin 2 at least on the edge of the circuit board 1. COPYRIGHT: (C)2011,JPO&INPIT