SILVER CORE SILVER-COPPER ALLOY SHELL NANOFINE PARTICLE, ARTICLE DEPOSITED WITH THE FINE PARTICLE AND SINTERED ARTICLE DEPOSITED THEREWITH

PROBLEM TO BE SOLVED: To provide silver-copper alloy nanofine particles which can be sintered at low temperature for suppressing the electromigration of silver and the prevention in the oxidization of copper, and to provide a low temperature sintered thin film thereof which exhibits satisfactory electric conductivity. SOLUTION: For suppressing the electromigration of silver, using copper having high production and usage track records in the industry, silver-copper alloy nanofine particles composed of a silver-copper alloy shell layer of several nm and silver core particles are produced. Since silver-copper lies in an alloy structure, copper is not oxidized even in the air, and the fact that it can be stably treated even in a dispersed state in a solvent even in powder is made clear. By performing spin coating onto a flexible plastic substrate using the silver-copper alloy nanofine particle-dispersed liquid, a spin-coated film deposited with the silver-copper alloy nanofine particles can be produced. Further, when the article deposited with the silver-copper alloy nanofine particles on the substrate is immersed into an ascorbic acid aqueous solution, it is sintered within 10 min even at a low temperature of 80°C, and is changed into a sintered film exhibiting satisfactory electric conductivity. COPYRIGHT: (C)2011,JPO&INPIT