ELECTRIC MULTILAYER COMPONENT

PROBLEM TO BE SOLVED: To provide an electric multilayer component having a higher integration density that has significantly reduced parasitic capacitances and inductances on one hand, and allows especially simple and space-saving mounting on a print board on the other hand. SOLUTION: The electric m...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BRUNNER SEBASTIAN, KLEEWEIN ALOIS, FEICHTINGER THOMAS, PUDMICH GUENTER, KRUMPHALS ROBERT
Format: Patent
Sprache:eng
Schlagworte:
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