ELECTRIC MULTILAYER COMPONENT

PROBLEM TO BE SOLVED: To provide an electric multilayer component having a higher integration density that has significantly reduced parasitic capacitances and inductances on one hand, and allows especially simple and space-saving mounting on a print board on the other hand. SOLUTION: The electric multilayer component has a substrate constructed using stacked dielectric material layers, wherein multiple conductive electrode areas are arranged in the substrate at intervals between the dielectric layers, and electrodes are formed in the electrode areas. Furthermore, at least two solder balls (bumps) are arranged on the surface of the substrate for electrical contact of the component, each bump being connected in an electrically conductive way to at least one electrode via a through contact arranged in the substrate, so that first and second electrode stacks are formed, each of the electrode stacks contacting only one solder ball. COPYRIGHT: (C)2011,JPO&INPIT