RESIN SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND CONDUCTIVE PASTE

PROBLEM TO BE SOLVED: To provide a resin substrate capable of improving reliability of a conductive layer, a method of manufacturing the same, and conductive paste. SOLUTION: This resin substrate includes: a plurality of resin layers 1A-1D each having a hole for a via hole conductor formed thereon;...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BANDAI HARUFUMI, KATO NOBORU, SASAKI JUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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