RESIN SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND CONDUCTIVE PASTE

PROBLEM TO BE SOLVED: To provide a resin substrate capable of improving reliability of a conductive layer, a method of manufacturing the same, and conductive paste. SOLUTION: This resin substrate includes: a plurality of resin layers 1A-1D each having a hole for a via hole conductor formed thereon;...

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Bibliographische Detailangaben
Hauptverfasser:	BANDAI HARUFUMI, KATO NOBORU, SASAKI JUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin substrate capable of improving reliability of a conductive layer, a method of manufacturing the same, and conductive paste. SOLUTION: This resin substrate includes: a plurality of resin layers 1A-1D each having a hole for a via hole conductor formed thereon; conductive layers 2A-2D formed on the plurality of resin layers 1A-1D; and via hole conductor parts 3A-3D for obtaining electrical conduction between the conductive layers 2A-2D formed on the plurality of resin layers 1A-1D. The via hole conductor parts 3A-3D are formed by filling, in the holes for via hole conductors, this conductive paste prepared by dispersing metal powder in a mixed solvent containing a first solvent solidifiable under vacuum and a second solvent vaporizable by heating, and solidifying the conductive paste filled in the holes for via hole conductors by being heated under vacuum. COPYRIGHT: (C)2011,JPO&INPIT