SUBSTRATE TREATMENT APPARATUS

PROBLEM TO BE SOLVED: To improve uniformity in the in-plane temperature distribution of a substrate in a heat treatment apparatus by means of a microwave. SOLUTION: A substrate treatment apparatus is equipped with: a treatment chamber 201 to treat the substrate; a substrate supporter 5 to support th...

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1. Verfasser: OKUNO MASAHISA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To improve uniformity in the in-plane temperature distribution of a substrate in a heat treatment apparatus by means of a microwave. SOLUTION: A substrate treatment apparatus is equipped with: a treatment chamber 201 to treat the substrate; a substrate supporter 5 to support the substrate in the treatment chamber; a gate 9 to open and close a substrate bringing in/out port 10 on the wall surface of the treatment chamber, and to constitute a part of an inner wall surface in the treatment chamber when the substrate bringing in/out port 10 is closed; and a microwave supplier 4 to supply the microwave into the treatment chamber. Among the inner wall surfaces in the treatment chamber, a side 8 connecting the side 7 opposite to the treatment surface of the substrate W supported to the substrate supporter 5 and the side 9 constituted by the gate are formed as declined to the treatment surface of the substrate W. COPYRIGHT: (C)2011,JPO&INPIT