LED PACKAGE

PROBLEM TO BE SOLVED: To provide a constitution that prevents an adhesive for joining a translucent cover and a substrate together from being forced out for an LED package having the translucent cover joined to the substrate. SOLUTION: The LED package includes a substrate 10, an LED element 20 mount...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MINATO TATSUYA, HAKAMADA SHINTARO
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a constitution that prevents an adhesive for joining a translucent cover and a substrate together from being forced out for an LED package having the translucent cover joined to the substrate. SOLUTION: The LED package includes a substrate 10, an LED element 20 mounted on the substrate, and a dome-shaped translucent cover 30 attached to the substrate via an adhesive 50 and surrounding the LED element, wherein a junction part 31 for the translucent cover with respect to the substrate has an inclined part 32 and a plane part 33, the inclined part being inclined to the substrate along an inner edge and/or an outer edge of the junction part, and the plane part continuing with the inclined part to come into contact with the substrate. COPYRIGHT: (C)2011,JPO&INPIT