SPUTTERING APPARATUS AND METHOD FOR MANUFACTURING DISPLAY ELEMENT

PROBLEM TO BE SOLVED: To provide a sputtering apparatus capable of depositing a thin film of the excellent film quality on a substrate by reducing the number of sputtering particles flying in the diagonal direction with a substrate surface being a reference with respect to the sputtering particles f...

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Bibliographische Detailangaben
1. Verfasser:	AONUMA DAISUKE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a sputtering apparatus capable of depositing a thin film of the excellent film quality on a substrate by reducing the number of sputtering particles flying in the diagonal direction with a substrate surface being a reference with respect to the sputtering particles flying onto the substrate from targets. SOLUTION: The sputtering apparatus executes the simultaneous discharge of a plurality of targets, and a cathode has a shield having an aperture surface with the area larger than the sputtering area of the targets in front thereof, and with the height larger than the thickness of the targets. COPYRIGHT: (C)2011,JPO&INPIT