DEVICE AND METHOD FOR MOUNTING COMPONENT

PROBLEM TO BE SOLVED: To provide a device for mounting a component capable of mounting a component even on a large board with high work efficiency. SOLUTION: In the device for mounting a component on a substrate transported along a first direction, a component supply unit includes a supply reel arou...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KOSAKA KAZUAKI, MURAOKA NOBUHIKO, KADOTA SHOZO, KABESHITA AKIRA
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a device for mounting a component capable of mounting a component even on a large board with high work efficiency. SOLUTION: In the device for mounting a component on a substrate transported along a first direction, a component supply unit includes a supply reel around which a tape-shaped component assembly with a plurality of components continuously held to a carrier tape is wound, and a take-up reel for taking up the carrier tape after being extracted from the tape-shaped component assembly, wherein the supply reel and the take-up reel are each arranged in an attitude along the first direction, and the tape-shaped component assembly is wound in the state where a protective tape is laminated on a surface of the carrier tape for holding the plurality of components. The component supply unit further includes a protective tape recovery reel for taking up the protective tape peeled during the time when it moves from the supply reel to a component extraction part, wherein the protective tape recovery reel is arranged to be superposed on the supply reel in parallel with each other in a second direction orthogonal to the first direction. COPYRIGHT: (C)2011,JPO&INPIT