ANNEALING APPARATUS AND METHOD

ANNEALING APPARATUS AND METHOD

PROBLEM TO BE SOLVED: To provide an annealing apparatus and method that obtain a desired temperature distribution of a semiconductor substrate in annealing. SOLUTION: The annealing apparatus 1 includes: a top lamp 22 that is arranged on a first area 201 above a wafer 4 and corresponding to the wafer...

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1. Verfasser: OHASHI TAKUO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator OHASHI TAKUO
description PROBLEM TO BE SOLVED: To provide an annealing apparatus and method that obtain a desired temperature distribution of a semiconductor substrate in annealing. SOLUTION: The annealing apparatus 1 includes: a top lamp 22 that is arranged on a first area 201 above a wafer 4 and corresponding to the wafer 4; a first and second lateral lamps 24, 26 that are arranged in a second area 202 located around the first area 201; and control unit 8 for controlling the top lamp 22, and the first and second lateral lamps 24, 26 to emit light at different timings. COPYRIGHT: (C)2011,JPO&INPIT
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title ANNEALING APPARATUS AND METHOD
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