ANNEALING APPARATUS AND METHOD
PROBLEM TO BE SOLVED: To provide an annealing apparatus and method that obtain a desired temperature distribution of a semiconductor substrate in annealing. SOLUTION: The annealing apparatus 1 includes: a top lamp 22 that is arranged on a first area 201 above a wafer 4 and corresponding to the wafer...
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| Sprache: | eng |
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To provide an annealing apparatus and method that obtain a desired temperature distribution of a semiconductor substrate in annealing. SOLUTION: The annealing apparatus 1 includes: a top lamp 22 that is arranged on a first area 201 above a wafer 4 and corresponding to the wafer 4; a first and second lateral lamps 24, 26 that are arranged in a second area 202 located around the first area 201; and control unit 8 for controlling the top lamp 22, and the first and second lateral lamps 24, 26 to emit light at different timings. COPYRIGHT: (C)2011,JPO&INPIT |
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