LIGHT-REFLECTIVE, ANISOTROPIC, ELECTROCONDUCTIVE ADHESIVE, AND LIGHT-EMITTING DEVICE

PROBLEM TO BE SOLVED: To provide an anisotropic, electroconductive adhesive which can improve light-emitting efficiency, when manufacturing a light-emitting device by flip-chip mounting a light-emitting element, such as a light-emitting diode element (LED), on a wiring board by the use of an anisotr...

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Bibliographische Detailangaben
Hauptverfasser:	UMAGOE HIDEAKI, NAMIKI HIDEJI, KANISAWA SHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an anisotropic, electroconductive adhesive which can improve light-emitting efficiency, when manufacturing a light-emitting device by flip-chip mounting a light-emitting element, such as a light-emitting diode element (LED), on a wiring board by the use of an anisotropic, electroconductive adhesive, without setting on the LED element the light reflective layer to increase the manufacturing cost, and to provide a light-emitting device formed by flip-chip mounting a light-emitting element on a wiring board by using this adhesive. SOLUTION: The light-reflective, anisotropic, electroconductive adhesive, which is used in order to connect anisotropically and electroconductively a light-emitting element on a wiring board. includes a thermosetting resin composition, electroconductive particles, and light-reflective, insulation particles. The light-reflective, insulation particles are at least one kind of particles selected from the group consisting of titanium oxide, boron nitride, zinc oxide, and aluminum oxide. COPYRIGHT: (C)2011,JPO&INPIT