RESIN SEALING SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To improve heat dissipation by suppressing an increase in heat resistance due to irregularities of an exposed side of a heat sink. SOLUTION: An insulating sheet material 6 to be bonded to the heat sink 3 has a structure formed by not directly exposing the surface of a sprayed alumina film 6b but exposing the rear surface of an Al plate 6a. Since the rear surface of the Al plate 6a is flat surface, when the insulating sheet material is connected to a base of a cooler via a silicon grease, contact heat resistance at a portion where the Al plate 6a is bonded can be greatly reduced, compared to the conventional case in which it is connected to the sprayed alumina film. COPYRIGHT: (C)2011,JPO&INPIT