SHIELD STRUCTURE AND ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide a shield structure capable of surely shielding an electronic apparatus surrounded by a shield frame even if a quantity of an adhesive agent for adhering the shield frame is large. SOLUTION: A shield structure for shielding an electronic apparatus disposed on a printe...

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Bibliographische Detailangaben
Hauptverfasser:	KAWAUCHI KIYOTAKA, HASEGAWA MASAYUKI, YOSHITOME SHUZO, KORI KATSUSHIGE, TERADA NAOYA, TAKATSUKA TAMOTSU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a shield structure capable of surely shielding an electronic apparatus surrounded by a shield frame even if a quantity of an adhesive agent for adhering the shield frame is large. SOLUTION: A shield structure for shielding an electronic apparatus disposed on a printed board comprises a shield frame adhered on the printed board by a brazing adhesive agent while the electronic apparatus is surrounded and a shield top panel covering an upper part of the shield frame. The shield top panel comprises a strip sagging from its outer edge, and the strip is removed from a corner of the top panel corresponding to a corner of the shield frame. COPYRIGHT: (C)2011,JPO&INPIT