LAMINATE FOR WIRING BOARD, WIRING BOARD, METHOD FOR MANUFACTURING THE LAMINATE FOR WIRING BOARD, AND METHOD FOR MANUFACTURING THE WIRING BOARD

PROBLEM TO BE SOLVED: To provide a laminate for a wiring board, which includes metal wiring formed on a substrate and having a thickness of nano level, can reduce the size of a device, has excellent conductivity and is manufactured easily; and to provide a wiring board. SOLUTION: A laminate 10 for a...

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Hauptverfasser:	KIYOKAWA HAJIME, HONDA SHOJIRO, KAWASHIMA MASAHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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