LAMINATE FOR WIRING BOARD, WIRING BOARD, METHOD FOR MANUFACTURING THE LAMINATE FOR WIRING BOARD, AND METHOD FOR MANUFACTURING THE WIRING BOARD

PROBLEM TO BE SOLVED: To provide a laminate for a wiring board, which includes metal wiring formed on a substrate and having a thickness of nano level, can reduce the size of a device, has excellent conductivity and is manufactured easily; and to provide a wiring board. SOLUTION: A laminate 10 for a...

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Hauptverfasser:	KIYOKAWA HAJIME, HONDA SHOJIRO, KAWASHIMA MASAHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a laminate for a wiring board, which includes metal wiring formed on a substrate and having a thickness of nano level, can reduce the size of a device, has excellent conductivity and is manufactured easily; and to provide a wiring board. SOLUTION: A laminate 10 for a wiring board includes a substrate 14 and a metal layer 12 that has a thickness of 40-800 nm and is formed on the substrate 14 by arranging catalyst nuclei of electroless plating at an interval of 1 μm or less on a surface of the substrate 14 so that metal is deposited from the catalyst nuclei. COPYRIGHT: (C)2011,JPO&INPIT