ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To suppress the generation of cracks in a housing due to the stress from a shielding material. SOLUTION: A bottom plate 50 and second side plates 52 and 53 are embedded, by insert molding on the bottom wall of a circuit-block housing 20 and the sidewalls of both left-right sides respectively in the shielding material 5, and a pair of first side plates 51 and 51 are abutted against the sidewalls of both front-rear sides of the circuit-block housing 20 and are housed inside the circuit-block housing 20. Accordingly, even when the shielding material 5 and a case 2 are heat-expanded and heat-shrunk, respectively by temperature change, only the stresses from the second side plates 52 and 53 are applied to the sidewall of the case 2 (the circuit-block housing 20), and no stress is applied from the first side plates 51 and 51. Consequently, the stress applied to the sidewall of the case 2 is made smaller than in conventional examples, and as a result, generation of cracks in the sidewall of the case 2 are suppressed. COPYRIGHT: (C)2011,JPO&INPIT