METHOD AND DEVICE FOR SEPARATING AND CONVEYING WAFER

PROBLEM TO BE SOLVED: To stabilize and shorten a cycle time required for separating and conveying wafers while preventing damage to wafers. SOLUTION: In a device 100 for separating and conveying wafers, laminated wafers 2 are inclined to a water surface 12 and supported so that delivery sides of the...

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Bibliographische Detailangaben
Hauptverfasser: TANIZAKI HIROSHI, MURAI SHIRO, HASHIMOTO ISAMU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To stabilize and shorten a cycle time required for separating and conveying wafers while preventing damage to wafers. SOLUTION: In a device 100 for separating and conveying wafers, laminated wafers 2 are inclined to a water surface 12 and supported so that delivery sides of the laminated wafers 2 are heightened, and a highest wafer 1 in the laminated wafers 2 is slid in a delivery direction by a cut-out roller 4 rotated in a delivery direction S. In the device 100, the wafers 1 are fed between opposed feed roller 5 and a stopping roller 6, and the laminated wafers 2 are separated one by one. In the device 100, the feed roller 5 and the stopping roller 6 are supported by a movable frame 7 rotated while using a center of a rotation of the cut-out roller 4 as a fulcrum P and rotated integrally with the movable frame 7. In the device 100, the inclination of the laminated wafers 2 and the delivery direction of the wafers are conformed by a follow-up roller 8 rotatably mounted to the movable frame 7. COPYRIGHT: (C)2011,JPO&INPIT